A 273.48 TOPS/W and 1.58 Mb/mm2 Analog-Digital Hybrid CIM Processor with Transpose Ternary-eDRAM Bitcell
IEEE Asian Solid-State Circuits Conference (A-SSCC), 2024
Hoichang Jeong, Seungbin Kim, Jeongmin Shin, Keonhee Park, and Kyuho Jason Lee